ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,694, issued on July 14, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan). "Package structure" was invented by Yu-... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,695, issued on July 14, was assigned to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co. LTD. (Hebei Province, China), AVARY HOLDING (SHE... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,696, issued on July 14, was assigned to Apple Inc. (Cupertino, Calif.). "Transfer molding systems for semiconductor device packaging" was i... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,697, issued on July 14, was assigned to FUJIKURA PRINTED CIRCUITS LTD. (Tokyo). "Method for manufacturing wiring board" was invented by Dai... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,698, issued on July 14, was assigned to QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China) and Avary Holding (Shenzhen) Co. L... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,699, issued on July 14, was assigned to HEFEI BOE DISPLAY TECHNOLOGY Co. LTD. (Hefei, China) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,700, issued on July 14, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Stretchable device" was invented by Yui Nakamur... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,701, issued on July 14, was assigned to SUZHOU METABRAIN INTELLIGENT TECHNOLOGY Co. LTD. (Suzhou, China). "Wave soldering device, manufactu... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,703, issued on July 14, was assigned to ZHUHAI ACCESS SEMICONDUCTOR Co. LTD. (Guangdong, China). "Method for manufacturing a packaging subs... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,704, issued on July 14, was assigned to Sanmina Corp. (San Jose, Calif.). "Ultra thin dielectric printed circuit boards with thin laminates... Read More